Dispensing

In order to apply material fast and reliable on substrates, boards and modules, selective dispensing is a tool.
 

CeSMA can dispense material of a broad range of viscosities on various substrates using needle dispensing and micro-spray dispensing. The process can be applied for UV sensitive materials as well.

Typical example is the application of protection lacquers on printed circuit boards. Therefore, hybrid polymers can be used due to their low water vapour transition rates, the good bonding to different kind of surfaces and their excellent film forming properties.

The process can be used for structures with a width of  > 500 µm; the application of material is controlled automatically using graphic designs, CAD data or teaching modules.