Plasters with integrated sensors for diabetes patients "SensPflast"

Flexible sensor patch "SensPflast"
© Fraunhofer EMFT/Bernd Müller
Flexible sensor patch for integration into textiles

Diabetes is one of the most common diseases of civilisation. Around 15-25% of patients develop diabetic foot syndrome with nerve damage and circulatory disorders, particularly in the feet, during the course of their illness. A sensor patch can help to recognise critical conditions and treatment requirements at an early stage.

In the "SensPflast" project, researchers from the Fraunhofer Institutes ISC (pressure sensors), IIS (temperature/humidity sensors, electronics) and EMFT (assembly technology) developed a technology platform for wound plasters (size approx. 15 x 25 mm²) for diagnostic and therapeutic applications. Special features are the flexible and very thin structure (approx. 1 mm). The soft dielectric elastomer pressure sensors from ISC are ideally suited for the required softness of the entire sensor structure. The technology enables continuous, digital and networked therapy monitoring of pathological pressure, temperature and wound secretion conditions. Based on this information, treatment requirements can be identified at an early stage and the necessary medical therapy can be optimised, thus reducing serious secondary diseases and, as a result, the corresponding follow-up treatment costs.

Individualisation to the respective patient requirements requires flexible textile integration. Knitted bus cables and hot-melt adhesive processes enable the cost-effective production of sensor-equipped bandages or stockings. Integration under orthoses, in prostheses or in textile cover fabrics is also possible and extends the application possibilities for the parallel recording of different medically relevant parameters in bandages, stockings, supports or seat cushions of wheelchairs individually for each patient. Other measurement parameters, such as pH-value, lactate or muscle activity (ECG / EMG) could also be recorded with the technology by exchanging the sensor components.

Project "SensPflast"

The information sheet contains further information on application areas, technology and project outlook