Project SensPflast

Diabetes is one of the most widespread lifestyle diseases. A common consequence is diabetic foot syndrome, where pressure points and wounds often go unnoticed. To enable early detection, an intelligent sensor patch was developed that can be integrated into stockings and continuously monitors pressure, temperature, and moisture.

In the Fraunhofer-internal project "SensPflast," three institutes collaborated: Fraunhofer ISC developed the pressure sensors and packaging in the form of thin, flexible sensor films. Fraunhofer IIS was responsible for the microelectronics, including temperature and moisture sensors, while Fraunhofer EMFT contributed its expertise in assembly and interconnection technology.

The resulting technology platform – a wound patch with compact dimensions of approximately 15 × 25 × 1 mm³ – can also be transferred to other diagnostic and therapeutic applications with different sensor functions. A key advantage lies in its individual adaptability to patient-specific requirements. Through knitted bus cables and hot-melt bonding techniques, integration into sensorized bandages, stockings, orthoses, prostheses, or textile cover materials is possible.